Often overlooked and taken for granted, thermal paste is a necessary component in PC assembly and while the retail packaging for CPUs typically come with a heatsink and fan with thermal paste applied at the factory it typically isn't the best for ensuring that the maximum amount of heat is transferred from the processor to the heatsink especially if the CPU is going to be overclocked. Thermal paste is designed to take up the gaps between the heatsink and the IHS of the processor, thus eliminating the air in the gaps. Metal to metal contact is best for maximum heat transfer. There are many thermal pastes available, so which one does one choose from? We hope to shed a little light to this confusing topic.

In the past we have talked about the significance of ensuring that components stay within operating conditions to ensure long life and continued functionality.  Let us rehash it a little bit, electronics, in normal operations, generate heat. This heat needs to be moved away from the component and expelled. If the heat is not moved away or is allowed to remain, electromigration can occur. Electromigration is physical damage/wear to the traces cause by electrons moving through them. The more heat that is allowed to build up, the faster the electrons move, causing more damage. While there are numerous heatsink/fan combinations available, often over looked is the thermal interface material that resides between the IHS of the CPU and the base of the heatsink. Metal to metal contact is best for optimum heat transfer, but due to manufacturing and machining processes that may not be possible in many cases. So we have to use a thermal interface material. The main purpose of the thermal interface material is to fill minor gaps that can allow air to get trapped between the IHS of the processor and base of the heatsink, air is a great insulator and allows heat to remain close to the component. 

Today we are taking a look at Noctua's NT-H1 Thermal Interface Material. Noctua has a reputation in the industry for producing very competitive CPU coolers and fans. As the NT-H1 is non-conductive it can be used on GPUs and chipsets as well as CPUs. Maintaining the maximum amount of heat transfer will ensure long life of the components being used.